General Information
Launch Date
Q3 2025
Fabrication Process
TSMC
Die Size
~95 mm²
Socket Type
Mobile SoC
Instruction Set
ARMv9.2-A 64 bits
Process Node
3nm FinFET (TSMC N3P)
CPU Specifications
Core Count
6
Thread Count
6
Microarchitecture
2 x Apple10 (performance) + 4 x Apple10 (efficiency)
Clock Frequency
2 x 4.26 GHz + 4 x 2.60 GHz
CPU Performance Score
88
Cache Memory
L1 Instruction Cache
128 KB per core
L1 Data Cache
64 KB per core
L2 Cache
8 MB (P-cluster), 4 MB (E-cluster)
L3 Cache
12 MB System Level Cache (SLC)
Cache Performance Score
84
Memory Specifications
Memory Type
LPDDR5X
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
8 GB
ECC Memory Support
No
Memory Performance Score
86
GPU Specifications
GPU Name
Apple A19 GPU (5-core) with Neural Accelerators
GPU Clock Speed
1620 MHz
GPU Core Count
5
FP32 Performance
~2.08 TFLOPS
GPU Performance Score
88
Display & Camera
Max Screen Resolution
4K (3840 x 2160) @ 120Hz
Camera Support
Dual camera system, 48 MP Fusion + 12 MP ultra-wide
Max Camera Resolution
48 MP
Image Signal Processor
Next-generation Image Signal Processor
ISP Details
Apple10 ISP with updated display engine, Photonic Engine, Deep Fusion, Smart HDR 6, Next-generation portraits with improved Focus and Depth Control, Spatial photo and video capture, 4K60 Dolby Vision HDR recording, Cinematic mode up to 4K30, Action mode, Center Stage front camera with automatic framing, Dual Capture, Enhanced computational photography, Zero Shutter Lag, Camera Control
AI & Neural Processing
AI Performance Score
94
NPU Type
16-core Neural Engine
AI Performance (TOPS)
~38 TOPS
Connectivity
Integrated Modem
Apple C1 (Custom 5G) or Qualcomm X75
WLAN Support
5G NR (Sub-6 GHz only on C1 modem), 4G LTE Advanced
Modem Speed
5G Sub-6: Multi-gigabit speeds
Bluetooth Version
6.0
WiFi Standard
Wi-Fi 7 (802.11be)
Video & Media Capabilities
Video Decode Support
4K @ 120fps (H.264, HEVC, VP9, AV1, HDR10, HDR10+, Dolby Vision, HLG)
Video Encode Support
4K @ 60fps (H.264, HEVC)
Max Video Resolution
4K @ 60fps Dolby Vision HDR
Storage & Power Efficiency
Storage Type
NVMe (Gen 4.0)
Thermal Design Power
8-9W (peak), 3-4W (sustained)
Power Efficiency Score
90
Overall Efficiency Score
88
Benchmark Results
Geekbench 6 Single
~3608
Geekbench 6 Multi
~8810
AnTuTu 10
~1,750,000
GFXBench Aztec
N/A
Security & Additional Features
Security Features
Secure Enclave, Memory Integrity Enforcement (MIE) with ARM's Enhanced Memory Tagging Extension (EMTE) in synchronous mode, Secure Boot, Hardware-backed Keystore, Face ID, Apple Pay, Buffer overflow protection, Use-after-free vulnerability defense, Side-channel attack protection
Additional Features
Built on TSMC N3P third-generation 3nm process, Apple10 GPU architecture with Neural Accelerators in each GPU core, Doubled FP16 performance vs previous generation, Enhanced dynamic caching and unified image compression, Higher clock speeds (4.26 GHz) than A18, Powers iPhone 17, N1 wireless chip integration (Wi-Fi 7, Bluetooth 6, Thread), 5 GPU cores with 80 Execution Units and 640 ALUs, Codename: Tilos, 12MB System Level Cache, 8GB LPDDR5X-8533 RAM, 68.2 GB/s memory bandwidth, Hardware-accelerated ray tracing, Mesh shading, MetalFX upscaling, Memory Integrity Enforcement for enhanced security, Improved power efficiency from N3P process, Desktop-class GPU features in phone, On-device Apple Intelligence (image generation, text tools, Live Translation), Updated Display Engine for 120Hz Super Retina XDR with ProMotion, Camera improvements with smarter portraits and Dual Capture, Enhanced machine learning capabilities, All-day battery life with fast charging (50% in ~20 minutes), Third-gen 3nm brings better thermals and efficiency, USB 2.0 speeds, Wi-Fi 7 for improved bandwidth and stability, Bluetooth 6.0, Thread support for smart home, Advanced computational photography, Spatial video for Apple Vision Pro