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Home SoCs HiSilicon Kirin 9010
Detailed Specifications

HiSilicon Kirin 9010

Q1 2024
SMIC
12 Cores

General Information

Launch Date
Q1 2024
Fabrication Process
SMIC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8.2-A 64 bits
Process Node
7nm (SMIC N+2)

CPU Specifications

Core Count
12
Thread Count
12
Microarchitecture
2 x Taishan V120 + 6 x Cortex-A78 + 4 x Cortex-A55
Clock Frequency
2 x 2.67 GHz + 6 x 2.32 GHz + 4 x 1.62 GHz
CPU Performance Score
72

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (big cores), 32 KB per core (A55)
L2 Cache
512 KB per big core, 128 KB per A55 core
L3 Cache
4 MB
Cache Performance Score
70

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
76

GPU Specifications

GPU Name
Maleoon 910 MP6
GPU Clock Speed
850 MHz
GPU Core Count
6
FP32 Performance
~1.9 TFLOPS
GPU Performance Score
70

Display & Camera

Max Screen Resolution
4K+ (3200 x 1440)
Camera Support
Single 200 MP or Dual 64 MP + 64 MP or Triple camera
Max Camera Resolution
200 MP
Image Signal Processor
Triple ISP
ISP Details
Triple 16-bit ISP with support for up to 200MP single camera, dual 64MP cameras, or triple camera setup, 4K @ 60fps video recording with HDR, Multi-frame AI noise reduction, Zero Shutter Lag with predictive focus, Advanced phase detection autofocus, Real-time bokeh effects with depth mapping, AI scene detection with 2000+ scenarios, Computational photography night mode, Variable aperture simulation, Multi-camera video recording, RAW domain processing with AI enhancement

AI & Neural Processing

AI Performance Score
N/A
NPU Type
Dual-core NPU (Da Vinci Architecture 3.0)
AI Performance (TOPS)
~14 TOPS

Connectivity

Integrated Modem
Integrated 5G Modem (Enhanced)
WLAN Support
5G NR SA/NSA, 4G LTE Cat 20, HSPA+, GSM/EDGE
Modem Speed
5G: 4.2 Gbps (DL), 2.3 Gbps (UL), 4G LTE: 2.0 Gbps (DL), 200 Mbps (UL)
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 6E (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 120fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode Support
4K @ 60fps (H.264, H.265, AV1)
Max Video Resolution
4K @ 120fps decode, 4K @ 60fps encode

Storage & Power Efficiency

Storage Type
UFS 4.0
Thermal Design Power
9W
Power Efficiency Score
68
Overall Efficiency Score
70

Benchmark Results

Geekbench 6 Single
~850
Geekbench 6 Multi
~3600
AnTuTu 10
~750000
GFXBench Aztec
N/A

Security & Additional Features

Security Features
TrustZone, Secure Boot, Hardware-backed Keystore, Enhanced Secure Element, Secure Payment, 3D Face Unlock with enhanced liveness detection, Ultrasonic in-display fingerprint support
Additional Features
Improved successor to Kirin 9000S with 12-core CPU architecture, Advanced SMIC 7nm N+2 process with optimizations, Innovative 2+6+4 CPU cluster design with 12 cores total, Dual Taishan V120 prime cores at 2.67 GHz, Six Cortex-A78 performance cores for sustained workloads, Enhanced Maleoon 910 MP6 GPU with 6 cores, Significant GPU performance improvement over 9000S, Higher clock speeds across all CPU clusters, Increased L3 cache to 4 MB for better performance, LPDDR5-3200 memory support with 51.2 GB/s bandwidth, UFS 4.0 storage for faster data transfer, Triple ISP supporting up to 200MP cameras, Enhanced dual-core NPU with 14 TOPS AI performance, Improved 5G modem with higher speeds, Wi-Fi 6E with 6GHz band support, Bluetooth 5.3 with LE Audio, AV1 hardware encoding support, 4K @ 120fps video playback capability, Used in Huawei Pura 70 series and Mate X5, Better gaming performance than 9000S, Improved thermal management with 12-core design, Multi-core architecture enables better workload distribution, Enhanced AI capabilities for photography and video, Supports high refresh rate displays up to 120Hz with LTPO, NavIC positioning system support, Advanced computational photography features, Represents continued evolution of domestic Chinese chips, More competitive with international flagship SoCs, Better sustained performance than 9000S, Improved power efficiency despite higher core count, Custom Maleoon GPU showing maturity, Symbol of China's advancing semiconductor capabilities
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