General Information
Launch Date
Q2 2019
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
12nm FinFET (TSMC 12nm FFC)
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
4 x Cortex-A73 (big) + 4 x Cortex-A53 (little)
Clock Frequency
4 x 2.2 GHz + 4 x 1.7 GHz
CPU Performance Score
54
Cache Memory
L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (A73), 32 KB per core (A53)
L2 Cache
2 MB shared
L3 Cache
N/A
Cache Performance Score
50
Memory Specifications
Memory Type
LPDDR4X
Memory Bus Width
64-bit
Memory Channels
2
Maximum Memory Size
6 GB
ECC Memory Support
No
Memory Performance Score
52
GPU Specifications
GPU Name
Mali-G51 MP4
GPU Clock Speed
650 MHz
GPU Core Count
4
FP32 Performance
~0.13 TFLOPS
GPU Performance Score
48
Display & Camera
Max Screen Resolution
FHD+ (2340 x 1080)
Camera Support
Single 40 MP or Dual 20 MP + 20 MP
Max Camera Resolution
40 MP
Image Signal Processor
Dual ISP 14-bit
ISP Details
Dual ISP with 14-bit processing, Support for 40MP single camera or dual 20MP cameras, Real-time bokeh effects, Multi-frame noise reduction, Hardware-based face detection, AI-enhanced photography, Phase detection autofocus, HDR video recording, Zero shutter lag
AI & Neural Processing
AI Performance Score
N/A
NPU Type
Kirin NPU (Dedicated Neural Processing Unit)
AI Performance (TOPS)
~0.5 TOPS
Connectivity
Integrated Modem
LTE Cat 12/13
WLAN Support
4G LTE Cat 12/13, HSPA+, GSM/EDGE
Modem Speed
4G LTE: 600 Mbps (DL), 150 Mbps (UL)
Bluetooth Version
5.0
WiFi Standard
Wi-Fi 5 (802.11ac)
Video & Media Capabilities
Video Decode Support
4K @ 30fps (H.264, H.265/HEVC)
Video Encode Support
4K @ 30fps (H.264, H.265)
Max Video Resolution
4K @ 30fps
Storage & Power Efficiency
Storage Type
UFS 2.1, eMMC 5.1
Thermal Design Power
5W
Power Efficiency Score
62
Overall Efficiency Score
58
Benchmark Results
Geekbench 6 Single
N/A
Geekbench 6 Multi
N/A
AnTuTu 10
N/A
GFXBench Aztec
N/A
Security & Additional Features
Security Features
ARM TrustZone, Secure Boot, inSE (integrated Secure Element), Hardware-backed Keystore, Face unlock support, Fingerprint authentication
Additional Features
Refreshed version of Kirin 710 with minor improvements, Same core architecture as Kirin 710 with identical CPU/GPU configuration, Upgraded Bluetooth from 4.2 to 5.0 for better wireless connectivity, Enhanced Bluetooth audio quality and range, Same 12nm TSMC manufacturing process, Identical performance characteristics to Kirin 710, Minor power efficiency optimizations, Used in later mid-range Huawei/Honor devices, Featured in Honor 9X Lite, Huawei P Smart Pro, Honor 20 Lite, Maintains strong AI photography capabilities, GPU Turbo technology support for gaming, LPDDR4X memory support for power efficiency, Dual ISP with AI enhancements, LTE Cat 12/13 modem, Support for dual 4G VoLTE, Wi-Fi 802.11ac with 2x2 MIMO, Bluetooth 5.0 with improved low energy features, Cost-effective alternative to flagship chipsets, Good thermal management, Reliable sustained performance, Support for GPU Turbo 3.0 gaming optimization, Excellent battery optimization, Competitive in mid-range segment, Strong software support from EMUI, Popular in budget and mid-range markets, Good compatibility with existing Kirin 710 ecosystem, Essentially a Kirin 710 with Bluetooth upgrade