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Home SoCs Qualcomm Snapdragon X Plus X1P-64-100
Detailed Specifications

Qualcomm Snapdragon X Plus X1P-64-100

Q2 2024
TSMC
10 Cores

General Information

Launch Date
Q2 2024
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Laptop SoC
Instruction Set
ARMv8.7-A 64 bits
Process Node
4nm (TSMC N4P)

CPU Specifications

Core Count
10
Thread Count
10
Microarchitecture
10 x Oryon (6+4 configuration)
Clock Frequency
All cores: 3.4 GHz, No boost
CPU Performance Score
80

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core
L2 Cache
30-42 MB total
L3 Cache
6 MB (shared system cache)
Cache Performance Score
78

Memory Specifications

Memory Type
LPDDR5X-8448
Memory Bus Width
128-bit
Memory Channels
4
Maximum Memory Size
64 GB
ECC Memory Support
No
Memory Performance Score
90

GPU Specifications

GPU Name
Adreno X1-85
GPU Clock Speed
N/A
GPU Core Count
N/A
FP32 Performance
3.8 TFLOPS
GPU Performance Score
72

Display & Camera

Max Screen Resolution
4K (3840 x 2160) @ 120Hz
Camera Support
Dual 36 MP or Single 64 MP
Max Camera Resolution
64 MP
Image Signal Processor
Qualcomm Spectra ISP
ISP Details
Qualcomm Spectra ISP with 4K HDR video capture, Advanced MIPI camera support, Auto-framing, Background blur, Facial authentication, Low-power imaging, Multi-camera support

AI & Neural Processing

AI Performance Score
92
NPU Type
Qualcomm Hexagon NPU
AI Performance (TOPS)
45 TOPS

Connectivity

Integrated Modem
Snapdragon X55/X65 5G (discrete, optional)
WLAN Support
5G NR (optional), 4G LTE
Modem Speed
5G: Up to 10 Gbps (DL) with optional discrete modem
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 7 (802.11be) with HBS Multi-Link

Video & Media Capabilities

Video Decode Support
4K @ 120fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode Support
4K @ 60fps (H.264, H.265, AV1)
Max Video Resolution
4K @ 120fps decode

Storage & Power Efficiency

Storage Type
PCIe Gen 4 NVMe, UFS 4.0
Thermal Design Power
23-45W (dynamic scaling)
Power Efficiency Score
88
Overall Efficiency Score
85

Benchmark Results

Geekbench 6 Single
~2100
Geekbench 6 Multi
~13000
AnTuTu 10
N/A
GFXBench Aztec
N/A

Security & Additional Features

Security Features
Qualcomm Secure Processing Unit with Microsoft Pluton TPM, Total memory encryption, Microsoft Secured-Core PC support, Secure Boot, Enterprise security
Additional Features
Mainstream tier of Snapdragon X platform, 10-core Oryon CPU configuration, More affordable alternative to X Elite, Same 45 TOPS NPU as X Elite - full Copilot+ PC support, 10% faster than Apple M3 in Geekbench multi-core (claimed), Competitive with Intel Core Ultra 7 155H and AMD Ryzen 9 7940HS, Excellent power efficiency for extended battery life, Same LPDDR5X-8448 memory support as Elite, Strong integrated GPU at 3.8 TFLOPS, All cores run at 3.4 GHz sustained, Based on Qualcomm Oryon custom architecture, Windows 11 with full ARM64 support, Enhanced x86/x64 application emulation, Multi-day battery life capability, Support for triple 4K external displays at 60Hz, Always-connected PC capabilities, Fast instant-on performance, Used in mainstream premium laptops: Microsoft Surface Pro 11 Dell Inspiron 14 Plus, Enables sub-$1000 Copilot+ PCs, Fanless designs for silent operation, Optional 5G connectivity, Wi-Fi 7 with HBS Multi-Link, Excellent value proposition, Bridge between premium and mainstream markets, Strong AI performance matching flagship tier, Solid gaming capabilities for integrated graphics, Enterprise-grade security features, Perfect for professionals and students, Competitive pricing enables wider ARM adoption, Strong performance per watt, Sustainable performance without throttling
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