S

SOKYO

Analytics

Enterprise-grade SoC intelligence platform

© 2024 SOKYO Analytics

Home SoCs MediaTek Dimensity 8050
Detailed Specifications

MediaTek Dimensity 8050

Q2 2023
TSMC
8 Cores

General Information

Launch Date
Q2 2023
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8.2-A 64 bits
Process Node
6nm FinFET

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1 x Cortex-A78 + 3 x Cortex-A78 + 4 x Cortex-A55
Clock Frequency
1 x 3.0 GHz + 3 x 2.6 GHz + 4 x 2.0 GHz
CPU Performance Score
82

Cache Memory

L1 Instruction Cache
32-64 KB per core
L1 Data Cache
32-64 KB per core
L2 Cache
N/A
L3 Cache
N/A
Cache Performance Score
66

Memory Specifications

Memory Type
LPDDR4X / LPDDR5
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
70

GPU Specifications

GPU Name
ARM Mali-G77 MP9
GPU Clock Speed
850 MHz
GPU Core Count
9 cores
FP32 Performance
~0.979 TFLOPS
GPU Performance Score
78

Display & Camera

Max Screen Resolution
Full HD+ @ 168Hz
Camera Support
Single 200 MP
Max Camera Resolution
200 MP single
Image Signal Processor
MediaTek Imagiq (5-core HDR-ISP)
ISP Details
5-core HDR-ISP with 200MP support, Staggered 4K HDR video, AI-Panorama Night Shot, AI Multi-Person Bokeh, AI-NR, AI SDR-to-HDR, Hardware-based face detection, Multi-frame noise reduction

AI & Neural Processing

AI Performance Score
N/A
NPU Type
APU 3.0
AI Performance (TOPS)
N/A

Connectivity

Integrated Modem
Integrated 5G Modem
WLAN Support
5G Sub-6GHz (SA/NSA), LTE, HSPA+, GSM, FDD-LTE, TDD-LTE, WCDMA
Modem Speed
5G: 4.7 Gbps (DL), 2.5 Gbps (UL), 2CC 5G Carrier Aggregation (FDD+TDD), Dual 5G SIM (SA + SA), 4x4 MIMO, 256-QAM, VoNR
Bluetooth Version
5.2
WiFi Standard
Wi-Fi 6 (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 60fps (H.264, H.265/HEVC, VP9, AV1 hardware decode)
Video Encode Support
4K @ 60fps (H.264, H.265)
Max Video Resolution
4K @ 60fps decode / 4K @ 60fps encode

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
10W
Power Efficiency Score
78
Overall Efficiency Score
80

Benchmark Results

Geekbench 6 Single
993
Geekbench 6 Multi
3305
AnTuTu 10
732000
GFXBench Aztec
N/A

Security & Additional Features

Security Features
ARM TrustZone, Secure Boot, MediaTek TEE
Additional Features
TSMC 6nm chipset virtually identical to Dimensity 1200, Ultra-Core architecture (1x A78 @ 3.0GHz + 3x A78 @ 2.6GHz + 4x A55 @ 2.0GHz), Mali-G77 MP9 GPU, 200MP camera support, 5-core HDR-ISP with Staggered 4K HDR video, 168Hz display support, AV1 hardware decoding, HyperEngine 3.0, Dual 5G SIM (SA + SA) with VoNR, 4.7Gbps 5G speeds with 2CC CA, APU 3.0 with hexa-core NPU, Wi-Fi 6 and Bluetooth 5.2, LPDDR5 and UFS 3.1 support, Rebranded Dimensity 1200 for specific markets
Back to Home Compare This SoC