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Home SoCs Qualcomm Snapdragon 7s Gen 2
Detailed Specifications

Qualcomm Snapdragon 7s Gen 2

Q3 2023
TSMC 4nm
8 Cores

General Information

Launch Date
Q3 2023
Fabrication Process
TSMC 4nm
Die Size
N/A
Socket Type
BGA
Instruction Set
ARMv8.2-A 64 bits
Process Node
4nm

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
4x Kryo (A78): 2.4 GHz + 4x Kryo (A55): 1.95 GHz
Clock Frequency
Up to 2.4 GHz
CPU Performance Score
70

Cache Memory

L1 Instruction Cache
N/A
L1 Data Cache
N/A
L2 Cache
N/A
L3 Cache
N/A
Cache Performance Score
70

Memory Specifications

Memory Type
LPDDR5/LPDDR4X
Memory Bus Width
16 bits
Memory Channels
2
Maximum Memory Size
12 GB
ECC Memory Support
No
Memory Performance Score
75

GPU Specifications

GPU Name
Adreno 710
GPU Clock Speed
940 MHz
GPU Core Count
256 ALUs
FP32 Performance
N/A
GPU Performance Score
68

Display & Camera

Max Screen Resolution
2560 x 1080
Camera Support
Up to 200 MP Dual 32 + 16 MP, Triple 16 MP
Max Camera Resolution
200 MP
Image Signal Processor
Triple 12-bit Spectra ISP
ISP Details
Triple 12-bit Spectra ISP

AI & Neural Processing

AI Performance Score
72
NPU Type
AI Engine
AI Performance (TOPS)
N/A

Connectivity

Integrated Modem
X62 5G Modem
WLAN Support
802.11 a/b/g/n/ac/ax Tri-Band 2.4/5/6 GHz
Modem Speed
4.4 Gbps download
Bluetooth Version
5.2
WiFi Standard
Wi-Fi 6E

Video & Media Capabilities

Video Decode Support
4K @ 60fps
Video Encode Support
4K @ 30fps
Max Video Resolution
4K @ 60fps

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
8W
Power Efficiency Score
78
Overall Efficiency Score
78

Benchmark Results

Geekbench 6 Single
950
Geekbench 6 Multi
2750
AnTuTu 10
630000
GFXBench Aztec
32 fps

Security & Additional Features

Security Features
Qualcomm Trusted Execution Environment
Additional Features
X62 5G Modem, WiFi 6E, Triple 12-bit Spectra ISP, Embedded Hexagon DSP, USB 3.1
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