General Information
Launch
Q4 2025
Process
SMIC
Size
N/A
Socket
Mobile SoC
ISA
ARMv8-A / Custom 64 bits
Node
7nm FinFET (SMIC N+3)
CPU Specifications
Cores
8
Threads
8
Architecture
1 x TaiShan V121 + 4 x TaiShan V120 + 3 x Cortex-A510 / TaiShan-Little
Frequency
1 x 2.75 GHz + 4 x 2.25 GHz + 3 x 1.84 GHz
CPU Performance Score
86
Cache
L1 (I)
64 KB per core
L1 (D)
64 KB per core
L2 Cache
1 MB (Big core) + 512 KB (Medium cores) + 256 KB shared (Small cores)
L3 Cache
10 MB shared (Big and Medium cores only)
Cache Performance
78
Memory
Type
LPDDR5X
Bus Width
64-bit
Channels
4
Max Size
16 GB
ECC
No
Performance
76
GPU
GPU Name
Maleoon 930 (Ma Liang 930)
Clock
N/A
Cores
N/A
FP32
N/A
GPU Performance
82
Display & Camera
Max Resolution
QHD+ @ 120Hz
Camera Support
Single 200 MP
Max Camera
200 MP single
ISP
Huawei Custom ISP
Signal Processor
Advanced Huawei ISP with AI image processing, Ma Liang 930 GPU accelerates AI image processing, Night scene shot success rate increased by 92%, Dark detail 3 times sharper than iPhone 16 Pro Max, Multi-frame noise reduction, Hardware face detection, HDR photography and video, AI-enhanced computational photography
AI & NPU
AI Score
N/A
NPU Type
Huawei Da Vinci NPU (3rd Gen)
AI TOPS
~31.0 TOPS
Connectivity
Modem
Integrated 5G-A Modem
WLAN
5G-Advanced Sub-6GHz (SA/NSA), LTE, HSPA+, GSM, Satellite communication (5G NTN)
Modem Speed
5G-A: Enhanced speeds with 3GPP R18 support, Integrated satellite communication chip, Dual 5G SIM support, VoNR
Bluetooth
5.3
WiFi Version
Wi-Fi 6E (802.11ax)
Video & Media
Video Decode
4K @ 60fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode
4K @ 60fps (H.264, H.265)
Max Video
4K @ 60fps
Storage & Power
Storage
UFS 3.1
TDP
10W
Power Score
82
Efficiency Score
84
Benchmarks
GB6 Single
2100
GB6 Multi
8500
AnTuTu 10
4200000
GFX Aztec
N/A
Security & Features
Security Features
ARM TrustZone, Secure Boot, Hardware-backed encryption, Huawei TEE
Features
World's first integrated satellite communication chip into SoC, Manufactured by SMIC using 7nm N+3 process (domestically produced in China), 1+4+3 tri-cluster architecture with TaiShan V121 prime core at 2.75GHz, 4x TaiShan V120 performance cores at 2.25GHz, 3x Cortex-A510/TaiShan-Little efficiency cores at 1.84GHz, 20% performance improvement over Kirin 9020, 60% performance boost compared to Kirin 9000S (Mate 60 Pro), 40% performance increase vs Kirin 9000s, Maleoon 930 (Ma Liang 930) GPU with ray tracing support, Da Vinci NPU 3rd Gen with 31 TOPS (3x previous generation), Enhanced HarmonyOS 6.0 system-level optimization, Active cooling system: Miniature turbine fan (28mm diameter, 1.2mm thick), Noise level only 25 decibels with metal frame airflow channel, Composite heat dissipation structure with VC heat dissipation plate and graphene thermal conductivity layer, Heat dissipation efficiency improved by 3 times, temperature reduced by 15°C under high load gaming, Intelligent scheduling with HarmonyOS 6.0 Ark Engine dynamically adjusts fan speed and chip power consumption, Energy efficiency ratio: 1.8W/GHz (better than Snapdragon 8 Gen 4), Reduced power consumption: 20% lower for same performance, Application startup speed improved 5 times, Smooth multitasking, 5600mAh battery supports 4 hours of Genshin Impact gameplay and 8 hours of video playback, Gaming performance: Stable frame rate 58 fps (60 fps for Snapdragon with 4 fps fluctuation), Body temperature: 41°C (49°C for Snapdragon models), Image experience: Night scene shot success rate increased by 92%, Dark detail 3 times sharper than iPhone 16 Pro Max, 3GPP Release 18 5G-Advanced support (industry first), Satellite communication integrated directly into SoC chipset, SMIC 7nm N+3 manufacturing breakthrough with etching technology achieving 120 million transistors/mm² density (close to international 5nm level), 10MB L3 cache shared between big and medium cores, 8MB SLC system cache, 1.8W/GHz energy efficiency (better than Snapdragon 8 Gen 4), Comprehensive coverage of games and daily life, HarmonyOS optimization key to performance, Powers Huawei Mate 80 series, Mate X7 foldable, XT 2 tri-fold, and future Pura series (early 2026), Breaking through technological barriers despite US sanctions, Demonstrates China's domestic chip manufacturing capabilities