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Home SoCs MediaTek Dimensity 930
Detailed Specifications

MediaTek Dimensity 930

Q2 2022
TSMC
8 Cores

General Information

Launch Date
Q2 2022
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
6nm FinFET

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
2 x Cortex-A78 + 6 x Cortex-A55
Clock Frequency
2 x 2.2 GHz + 6 x 2.0 GHz
CPU Performance Score
68

Cache Memory

L1 Instruction Cache
32-64 KB per core
L1 Data Cache
32-64 KB per core
L2 Cache
N/A
L3 Cache
N/A
Cache Performance Score
53

Memory Specifications

Memory Type
LPDDR5 / LPDDR4X
Memory Bus Width
32-bit
Memory Channels
2
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
68

GPU Specifications

GPU Name
IMG BXM-8-256
GPU Clock Speed
900 MHz
GPU Core Count
N/A
FP32 Performance
~0.46 TFLOPS
GPU Performance Score
65

Display & Camera

Max Screen Resolution
Full HD+ (2520 x 1080) @ 120Hz
Camera Support
Multi-camera support
Max Camera Resolution
N/A
Image Signal Processor
MediaTek Imagiq
ISP Details
ISP with 4K video recording, HDR support, Multi-frame NR, Hardware Depth Engine, AI enhancements, Bokeh

AI & Neural Processing

AI Performance Score
N/A
NPU Type
APU 3.0
AI Performance (TOPS)
N/A

Connectivity

Integrated Modem
Integrated 5G Modem
WLAN Support
5G Sub-6GHz (SA/NSA), LTE, HSPA+, GSM, FDD-LTE, TDD-LTE, WCDMA
Modem Speed
5G: 2.77 Gbps (DL), 2CC 5G Carrier Aggregation (120MHz bandwidth), 4x4 MIMO, 256-QAM
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 5 (802.11ac)

Video & Media Capabilities

Video Decode Support
4K @ 30fps (H.264, H.265/HEVC)
Video Encode Support
4K @ 30fps (H.264, H.265)
Max Video Resolution
4K @ 30fps decode / 4K @ 30fps encode

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
10W
Power Efficiency Score
80
Overall Efficiency Score
76

Benchmark Results

Geekbench 6 Single
922
Geekbench 6 Multi
2239
AnTuTu 10
544734
GFXBench Aztec
N/A

Security & Additional Features

Security Features
ARM TrustZone, Secure Boot, MediaTek TEE
Additional Features
6nm process with improved power efficiency (15% less energy than D920), PowerVR IMG BXM-8-256 GPU (faster than Mali-G68 in some scenarios), MiraVision Smart Contrast and Local Tone Mapping for enhanced streaming video, HyperEngine gaming with intelligent multi-network management and low-latency networking, Dual 5G SIM with VoNR, 5G Call & Data Concurrency 3.0, 120Hz display support, LPDDR5 RAM and UFS 3.1 storage support, 5G UltraSave power optimization, Bluetooth 5.3
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