S

SOKYO

Analytics

Enterprise-grade SoC intelligence platform

© 2024 SOKYO Analytics

Home SoCs Qualcomm Snapdragon 888
Detailed Specifications

Qualcomm Snapdragon 888

Q4 2020
Samsung
8 Cores

General Information

Launch Date
Q4 2020
Fabrication Process
Samsung
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
5nm FinFET (Samsung 5LPE)

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1 x Cortex-X1 (Prime) + 3 x Cortex-A78 (Performance) + 4 x Cortex-A55 (Efficiency)
Clock Frequency
1 x 2.84 GHz + 3 x 2.42 GHz + 4 x 1.8 GHz
CPU Performance Score
90

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core
L2 Cache
512 KB per performance core, 256 KB per efficiency core
L3 Cache
6 MB system cache
Cache Performance Score
86

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
64-bit
Memory Channels
2
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
88

GPU Specifications

GPU Name
Adreno 660
GPU Clock Speed
840 MHz
GPU Core Count
N/A
FP32 Performance
~1.5 TFLOPS
GPU Performance Score
91

Display & Camera

Max Screen Resolution
4K (3840 x 2160) @ 60Hz
Camera Support
Single 200 MP or Triple 28 MP
Max Camera Resolution
200 MP
Image Signal Processor
Qualcomm Spectra 580 ISP
ISP Details
Qualcomm Spectra 580 Triple ISP with Triple 14-bit, 2.7 Gigapixel per second processing, First triple ISP in a smartphone chip, 8K @ 30fps video capture, 4K HDR video at 120fps, 720p @ 960fps slow-motion, Computational HDR with triple camera support, Simultaneous capture from three cameras, Hardware-accelerated depth mapping, Real-time semantic segmentation, HEIF photo capture, Multi-frame noise reduction

AI & Neural Processing

AI Performance Score
N/A
NPU Type
Qualcomm Hexagon 780 DSP with Tensor Accelerator
AI Performance (TOPS)
26 TOPS

Connectivity

Integrated Modem
Snapdragon X60 5G (integrated)
WLAN Support
5G NR (mmWave + Sub-6), 4G LTE Cat 24, HSPA+, GSM/EDGE
Modem Speed
5G: 7.5 Gbps (DL), 3 Gbps (UL), 4G LTE: 2.5 Gbps (DL), 316 Mbps (UL)
Bluetooth Version
5.2
WiFi Standard
Wi-Fi 6E (802.11ax)

Video & Media Capabilities

Video Decode Support
8K @ 30fps, 4K @ 120fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode Support
8K @ 30fps, 4K @ 120fps (H.264, H.265)
Max Video Resolution
8K @ 30fps encode, 4K @ 120fps encode/decode

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
6-8W
Power Efficiency Score
75
Overall Efficiency Score
82

Benchmark Results

Geekbench 6 Single
N/A
Geekbench 6 Multi
N/A
AnTuTu 10
N/A
GFXBench Aztec
N/A

Security & Additional Features

Security Features
Qualcomm Secure Processing Unit, TrustZone, Secure Boot, Hardware-backed Keystore, Qualcomm Content Protection, SafeSwitch, Hypervisor, Qualcomm Secure MSM
Additional Features
Qualcomm's flagship 2021 processor, First Snapdragon with integrated 5G modem (X60), First Snapdragon built on 5nm process (Samsung 5LPE), First use of ARM Cortex-X1 prime core in Snapdragon, 25% CPU performance improvement over Snapdragon 865, Adreno 660 with 35% GPU performance improvement, First triple ISP (Spectra 580) in mobile industry, 6th generation AI Engine with 73% AI performance boost, 26 TOPS AI performance, First Snapdragon with Wi-Fi 6E support, Bluetooth 5.2 with LE Audio support, 3rd generation Snapdragon Elite Gaming features, Hardware-accelerated AV1 video decode, Variable Rate Shading (VRS) support, 144Hz display support at QHD+ resolution, Quick Charge 5 support with 100W+ charging, Used in flagship devices including Samsung Galaxy S21 series, Xiaomi Mi 11 series, OnePlus 9 series, Oppo Find X3 Pro, Vivo X60 Pro+, ASUS ROG Phone 5, Known for thermal challenges due to Samsung 5nm process, High performance but thermal throttling concerns, Improved 5G connectivity with integrated modem, Support for global 5G bands including mmWave, Computational photography improvements with triple ISP, First Snapdragon with 4K HDR video at 120fps, Improved sustained performance compared to early firmware, Popular despite thermal reputation, Strong gaming performance when thermally managed
Back to Home Compare This SoC