General Information
Launch Date
August 2024
Fabrication Process
TSMC
Die Size
N/A
Socket Type
BGA
Instruction Set
ARMv9-A
Process Node
4nm
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
1x Cortex-A720 + 3x Cortex-A720 + 4x Cortex-A520
Clock Frequency
2.5 GHz
CPU Performance Score
78
Cache Memory
L1 Instruction Cache
N/A
L1 Data Cache
N/A
L2 Cache
N/A
L3 Cache
N/A
Cache Performance Score
75
Memory Specifications
Memory Type
LPDDR5/LPDDR4X
Memory Bus Width
2x 16-bit
Memory Channels
2
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
80
GPU Specifications
GPU Name
Qualcomm Adreno 810
GPU Clock Speed
N/A
GPU Core Count
N/A
FP32 Performance
N/A
GPU Performance Score
75
Display & Camera
Max Screen Resolution
FHD+
Camera Support
200MP
Max Camera Resolution
200MP
Image Signal Processor
Qualcomm Spectra Triple ISP
ISP Details
Spectra Triple ISP
AI & Neural Processing
AI Performance Score
30% improvement over 7s Gen 2
NPU Type
Qualcomm Hexagon NPU
AI Performance (TOPS)
N/A
Connectivity
Integrated Modem
Snapdragon X62 5G Modem-RF System
WLAN Support
Wi-Fi 6E, Wi-Fi 6
Modem Speed
2.9 Gbps downlink
Bluetooth Version
5.4
WiFi Standard
Wi-Fi 6E
Video & Media Capabilities
Video Decode Support
4K @ 30 FPS
Video Encode Support
4K @ 30 FPS
Max Video Resolution
4K @ 30 FPS
Storage & Power Efficiency
Storage Type
UFS 3.1
Thermal Design Power
N/A
Power Efficiency Score
99.7% GPU stability (no throttling)
Overall Efficiency Score
95
Benchmark Results
Geekbench 6 Single
1164
Geekbench 6 Multi
3252
AnTuTu 10
783345
GFXBench Aztec
1049
Security & Additional Features
Security Features
Qualcomm Trusted Execution Environment
Additional Features
AI-enhanced camera, Triple frequency GNSS, Excellent thermal stability