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Home SoCs MediaTek Dimensity 8500
Detailed Specifications

MediaTek Dimensity 8500

Q1 2026
TSMC
8 Cores

General Information

Launch Date
Q1 2026
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv9.2-A 64 bits
Process Node
4nm FinFET (TSMC N4P)

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
8 x Cortex-A725 (All-Big-Core)
Clock Frequency
1 x 3.40 GHz + 3 x 3.20 GHz + 4 x 2.20 GHz
CPU Performance Score
72

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core
L2 Cache
512 KB per core
L3 Cache
N/A
Cache Performance Score
70

Memory Specifications

Memory Type
LPDDR5X
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
74

GPU Specifications

GPU Name
Mali-G720 MC8
GPU Clock Speed
1500 MHz
GPU Core Count
8
FP32 Performance
2.4 TFLOPS
GPU Performance Score
74

Display & Camera

Max Screen Resolution
WQHD+ (3200 x 1440)
Camera Support
Single 320 MP or Dual 32 MP + 32 MP or Triple camera
Max Camera Resolution
320 MP
Image Signal Processor
Imagiq 1080 ISP
ISP Details
Imagiq 1080 ISP with support for up to 320MP single camera or triple 32MP cameras, 4K @ 60fps HDR video recording with multi-frame EIS, Zero Shutter Lag with AI prediction, Full-pixel phase detection autofocus, AI Ultra-Clear Telephoto Algorithm, Semantic segmentation for scene analysis, AI-powered reflection and glare removal, Cinema-grade 4K HDR video recording, Advanced noise reduction with AI, Real-time bokeh effects, Multi-camera video recording support

AI & Neural Processing

AI Performance Score
N/A
NPU Type
NPU 880 (8th Gen NPU)
AI Performance (TOPS)
~12 TOPS

Connectivity

Integrated Modem
Integrated 5G Modem
WLAN Support
5G NR SA/NSA Sub-6GHz, 4G LTE Cat 18, HSPA+, GSM/EDGE
Modem Speed
5G: 5.17 Gbps (DL), 2.5 Gbps (UL) with 3CC carrier aggregation, 4G LTE: 1.6 Gbps (DL), 200 Mbps (UL)
Bluetooth Version
5.4
WiFi Standard
Wi-Fi 6E (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 60fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode Support
4K @ 60fps (H.264, H.265)
Max Video Resolution
4K @ 60fps

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
10W
Power Efficiency Score
72
Overall Efficiency Score
74

Benchmark Results

Geekbench 6 Single
1728
Geekbench 6 Multi
6762
AnTuTu 10
2200000
GFXBench Aztec
N/A

Security & Additional Features

Security Features
TrustZone, Secure Boot, Hardware-backed Keystore, Secure Payment
Additional Features
Second-generation all-big-core architecture with only Cortex-A725 cores, Built on TSMC's N4P 4nm process for improved efficiency, Revolutionary design with no efficiency cores for maximum performance, 7% CPU performance improvement over Dimensity 8400, All eight cores are Cortex-A725 performance cores, Prime core clocked at 3.40 GHz for peak single-thread performance, Three performance cores at 3.20 GHz for sustained workloads, Four additional cores at 2.20 GHz maintaining high performance, LPDDR5X-9600 memory support with 12% bandwidth increase, Mali-G720 MC8 GPU with 8 cores, 25% GPU performance improvement over previous generation, 20% reduction in GPU power consumption at peak load, First chip in its segment with hardware-accelerated ray tracing, GPU clocked at 1500 MHz for enhanced gaming, Capable of stable 110+ fps gaming even at 35°C outdoor temperatures, MediaTek Dimensity Multi-Frame Rate technology, Up to 30% power savings during gaming, Up to 37% power savings in MOBA titles, NPU 880 for advanced AI processing, On-device generative AI support, Real-time translation and image generation capabilities, Compatible with major LLM and MLLM models, Dimensity AI Development Kit support, Imagiq 1080 ISP supporting up to 320MP cameras, AI Ultra-Clear Telephoto Algorithm, Semantic segmentation for intelligent scene analysis, AI-powered reflection and glare removal, Cinema-grade 4K HDR video recording, Zero Shutter Lag with predictive focus, Full-pixel phase detection autofocus, 5G modem with 5.17 Gbps download speeds, Three-carrier aggregation (3CC) support, Dual-SIM dual-standby capability, MediaTek UltraSave 3.0+ power optimization, Wi-Fi 6E with tri-band support, Bluetooth 5.4 with LE Audio, Support for high refresh rate displays up to 120Hz, MediaTek HyperEngine gaming optimizations, Accurate scheduling technology for efficient task management, Expected in Honor Power 2 and POCO X8 Pro, Competitive with Snapdragon 8 Gen 3 GPU performance theoretically, Positioned as premium mid-range flagship killer, Excellent thermal management for sustained performance, Strong multi-core performance for multitasking, Superior to Dimensity 8450 in all metrics, Aimed at bringing flagship experiences to mid-range segment, Support for advanced computational photography, Ray tracing support for realistic mobile gaming graphics, Enhanced battery life through intelligent power management
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