General Information
Launch Date
Q4 2020
Fabrication Process
SMIC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
14nm FinFET (SMIC 14nm)
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
4 x Cortex-A73 (big) + 4 x Cortex-A53 (little)
Clock Frequency
4 x 2.0 GHz + 4 x 1.7 GHz
CPU Performance Score
50
Cache Memory
L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (A73), 32 KB per core (A53)
L2 Cache
2 MB shared
L3 Cache
N/A
Cache Performance Score
50
Memory Specifications
Memory Type
LPDDR4X
Memory Bus Width
64-bit
Memory Channels
2
Maximum Memory Size
6 GB
ECC Memory Support
No
Memory Performance Score
52
GPU Specifications
GPU Name
Mali-G51 MP4
GPU Clock Speed
600 MHz
GPU Core Count
4
FP32 Performance
~0.12 TFLOPS
GPU Performance Score
46
Display & Camera
Max Screen Resolution
FHD+ (2340 x 1080)
Camera Support
Single 40 MP or Dual 20 MP + 20 MP
Max Camera Resolution
40 MP
Image Signal Processor
Dual ISP 14-bit
ISP Details
Dual ISP with 14-bit processing, Support for 40MP single camera or dual 20MP cameras, Real-time bokeh effects, Multi-frame noise reduction, Hardware-based face detection, AI-enhanced photography, Phase detection autofocus, HDR video recording, Zero shutter lag
AI & Neural Processing
AI Performance Score
N/A
NPU Type
Kirin NPU (Dedicated Neural Processing Unit)
AI Performance (TOPS)
~0.5 TOPS
Connectivity
Integrated Modem
LTE Cat 12/13
WLAN Support
4G LTE Cat 12/13, HSPA+, GSM/EDGE
Modem Speed
4G LTE: 600 Mbps (DL), 150 Mbps (UL)
Bluetooth Version
5.1
WiFi Standard
Wi-Fi 5 (802.11ac)
Video & Media Capabilities
Video Decode Support
4K @ 30fps (H.264, H.265/HEVC)
Video Encode Support
4K @ 30fps (H.264, H.265)
Max Video Resolution
4K @ 30fps
Storage & Power Efficiency
Storage Type
UFS 2.1, eMMC 5.1
Thermal Design Power
5.5W
Power Efficiency Score
58
Overall Efficiency Score
54
Benchmark Results
Geekbench 6 Single
N/A
Geekbench 6 Multi
N/A
AnTuTu 10
N/A
GFXBench Aztec
N/A
Security & Additional Features
Security Features
ARM TrustZone, Secure Boot, inSE (integrated Secure Element), Hardware-backed Keystore, Face unlock support, Fingerprint authentication
Additional Features
Manufactured by SMIC instead of TSMC due to US trade restrictions, 14nm process instead of 12nm resulting in lower efficiency, Lower CPU clock speeds (2.0 GHz vs 2.2 GHz big cores) compared to Kirin 710, Lower GPU clock speed (600 MHz vs 650 MHz) affecting graphics performance, Response to US semiconductor restrictions on Huawei, First Kirin chip manufactured entirely with Chinese foundry technology, Same core architecture as Kirin 710/710F, Slightly higher TDP due to less efficient 14nm process, Reduced performance compared to original Kirin 710, Bluetooth upgraded to 5.1, Used exclusively in China domestic market, Featured in Huawei Enjoy 20e, Honor Play 4T, Strategic chipset for Chinese market independence, Demonstrates Huawei's supply chain adaptation, SMIC 14nm technology maturity demonstration, Maintains compatibility with Kirin 710 software ecosystem, Same AI NPU capabilities as Kirin 710, Dual ISP with AI enhancements preserved, LTE Cat 12/13 modem maintained, GPU Turbo support retained, LPDDR4X memory support, Slightly higher power consumption than 12nm variants, Good thermal management despite larger process node, Represents geopolitical impact on semiconductor industry, Important for Huawei's domestic market strategy, Bridge solution during supply chain challenges, Lower performance but maintained feature set