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Home SoCs Qualcomm Snapdragon 7+ Gen 2
Detailed Specifications

Qualcomm Snapdragon 7+ Gen 2

Q1 2023
TSMC 4nm
8 Cores

General Information

Launch Date
Q1 2023
Fabrication Process
TSMC 4nm
Die Size
N/A
Socket Type
BGA
Instruction Set
ARMv9-A 64 bits
Process Node
4nm

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1x Kryo Prime (X2): 2.91 GHz + 3x Kryo (A710): 2.49 GHz + 4x Kryo (A510): 1.8 GHz
Clock Frequency
Up to 2.91 GHz
CPU Performance Score
80

Cache Memory

L1 Instruction Cache
N/A
L1 Data Cache
N/A
L2 Cache
N/A
L3 Cache
N/A
Cache Performance Score
78

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
16 bits
Memory Channels
2
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
82

GPU Specifications

GPU Name
Adreno 725
GPU Clock Speed
580 MHz
GPU Core Count
1024 ALUs
FP32 Performance
1.188 TFLOPS
GPU Performance Score
78

Display & Camera

Max Screen Resolution
3840 x 2160
Camera Support
Up to 200 MP Dual 64 + 36 MP, Triple 32 MP
Max Camera Resolution
200 MP
Image Signal Processor
Triple 18-bit Spectra ISP
ISP Details
Triple 18-bit Spectra ISP

AI & Neural Processing

AI Performance Score
82
NPU Type
AI Engine
AI Performance (TOPS)
N/A

Connectivity

Integrated Modem
X62 5G Modem
WLAN Support
802.11 a/b/g/n/ac/ax Tri-Band 2.4/5/6 GHz
Modem Speed
4.4 Gbps download
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 6E

Video & Media Capabilities

Video Decode Support
4K @ 120fps, 8K @ 30fps
Video Encode Support
4K @ 60fps
Max Video Resolution
8K @ 30fps

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
9W
Power Efficiency Score
84
Overall Efficiency Score
84

Benchmark Results

Geekbench 6 Single
1300
Geekbench 6 Multi
4000
AnTuTu 10
1050000
GFXBench Aztec
55 fps

Security & Additional Features

Security Features
Qualcomm Trusted Execution Environment
Additional Features
X62 5G Modem, WiFi 6E, Triple 18-bit Spectra ISP, Embedded Hexagon DSP
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