General Information
Launch Date
Q4 2019
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
7nm FinFET
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
4 x Cortex-A77 + 4 x Cortex-A55
Clock Frequency
4 x 2.2 GHz + 4 x 2.0 GHz
CPU Performance Score
74
Cache Memory
L1 Instruction Cache
32-64 KB per core
L1 Data Cache
32-64 KB per core
L2 Cache
1 MB
L3 Cache
N/A
Cache Performance Score
56
Memory Specifications
Memory Type
LPDDR4X
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
63
GPU Specifications
GPU Name
ARM Mali-G77 MP9
GPU Clock Speed
836 MHz
GPU Core Count
9 cores
FP32 Performance
~0.969 TFLOPS
GPU Performance Score
72
Display & Camera
Max Screen Resolution
Full HD+ @ 120Hz / 2K+ @ 90Hz
Camera Support
Single 80 MP / Dual 32 MP + 16 MP
Max Camera Resolution
80 MP single
Image Signal Processor
MediaTek Imagiq 5.0
ISP Details
5-core ISP with Imagiq+ technology, Multi-frame video HDR, AI-camera enhancements, ZSD, 24fps @ 80MP
AI & Neural Processing
AI Performance Score
N/A
NPU Type
APU 3.0
AI Performance (TOPS)
4.5
Connectivity
Integrated Modem
Integrated 5G Modem
WLAN Support
5G Sub-6GHz (SA/NSA), LTE, HSPA+, GSM, FDD-LTE, TDD-LTE, WCDMA, CDMA2000, TD-SCDMA
Modem Speed
5G: 4.7 Gbps (DL), 2.3 Gbps (UL), 2CC 5G Carrier Aggregation
Bluetooth Version
5.1+
WiFi Standard
Wi-Fi 6 (802.11ax)
Video & Media Capabilities
Video Decode Support
4K @ 30fps (H.264, H.265/HEVC, VP9)
Video Encode Support
4K @ 30fps (H.264, H.265)
Max Video Resolution
4K @ 30fps decode / 4K @ 30fps encode
Storage & Power Efficiency
Storage Type
UFS 2.2
Thermal Design Power
10W
Power Efficiency Score
70
Overall Efficiency Score
73
Benchmark Results
Geekbench 6 Single
800
Geekbench 6 Multi
2443
AnTuTu 10
541779
GFXBench Aztec
N/A
Security & Additional Features
Security Features
ARM TrustZone, Secure Boot, MediaTek TEE
Additional Features
Downclocked version of Dimensity 1000 (2.2GHz vs 2.6GHz on A77 cores), First in Dimensity 1000 family to ship, 7nm process with 4x Cortex-A77 cores, Dual 5G SIM with VoNR, 5-core ISP supporting 80MP cameras, APU 3.0 with 4.5 TOPS AI processing, 5G carrier aggregation (2CC CA) with 4.7Gbps downlink, HyperEngine 2.0 gaming optimizations, MiraVision with 4K HDR enhancement, Wi-Fi 6 and Bluetooth 5.1+ integrated, Launched in OPPO Reno 3 5G