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Home SoCs MediaTek Dimensity 8250
Detailed Specifications

MediaTek Dimensity 8250

Q4 2023
TSMC
8 Cores

General Information

Launch Date
Q4 2023
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv9.0-A 64 bits
Process Node
4nm FinFET

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1 x Cortex-A78 + 3 x Cortex-A78 + 4 x Cortex-A55
Clock Frequency
1 x 3.1 GHz + 3 x 3.0 GHz + 4 x 2.0 GHz
CPU Performance Score
86

Cache Memory

L1 Instruction Cache
32-64 KB per core
L1 Data Cache
32-64 KB per core
L2 Cache
N/A
L3 Cache
4 MB
Cache Performance Score
72

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
16 GB
ECC Memory Support
No
Memory Performance Score
76

GPU Specifications

GPU Name
ARM Mali-G610 MC6
GPU Clock Speed
950 MHz
GPU Core Count
6 cores
FP32 Performance
~1.088 TFLOPS
GPU Performance Score
84

Display & Camera

Max Screen Resolution
Full HD+ @ 168Hz / WQHD+ @ 144Hz
Camera Support
Single 320 MP
Max Camera Resolution
320 MP single
Image Signal Processor
MediaTek Imagiq 785 (5-core ISP)
ISP Details
5-core Imagiq 785 ISP with 320MP support, 14-bit RAW and RGB processing, Simultaneous triple camera HDR video recording, 4K HDR video with AI enhancements, AI-FD (hardware face detection), AI-NR (noise reduction), Multi-frame processing

AI & Neural Processing

AI Performance Score
N/A
NPU Type
APU 580
AI Performance (TOPS)
N/A

Connectivity

Integrated Modem
Integrated 5G Modem
WLAN Support
5G Sub-6GHz (SA/NSA), LTE, HSPA+, GSM, FDD-LTE, TDD-LTE, WCDMA
Modem Speed
5G: 4.7 Gbps (DL), 3CC Carrier Aggregation (300MHz), Dual 5G SIM (SA + NSA), 4x4 MIMO, 256-QAM, VoNR, 5G UltraSave 2.0
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 6E (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 60fps (H.264, H.265/HEVC, VP9, AV1)
Video Encode Support
4K @ 60fps (H.264, H.265)
Max Video Resolution
4K @ 60fps

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
10W
Power Efficiency Score
82
Overall Efficiency Score
84

Benchmark Results

Geekbench 6 Single
1183
Geekbench 6 Multi
3779
AnTuTu 10
901874
GFXBench Aztec
N/A

Security & Additional Features

Security Features
ARM TrustZone, Secure Boot, MediaTek TEE
Additional Features
TSMC 4nm chipset essentially identical to Dimensity 8200, Ultra-Core design (1x A78 @ 3.1GHz + 3x A78 @ 3.0GHz + 4x A55 @ 2.0GHz), Mali-G610 MC6 at 950MHz, 4MB L3 cache, Imagiq 785 with 320MP camera support, Simultaneous triple camera HDR video, APU 580 for AI tasks, HyperEngine 6.0 with AI VRS 2.0, 5G UltraSave 2.0, 3CC 5G CA (300MHz), Tri-band Wi-Fi 6E and Bluetooth 5.3 LE Audio, LPDDR5 and UFS 3.1, Rebranded Dimensity 8200 for specific OEM partners and markets, Same flagship-level performance as 8200
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