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Home SoCs HiSilicon Kirin 9000
Detailed Specifications

HiSilicon Kirin 9000

Q4 2020
TSMC
8 Cores

General Information

Launch Date
Q4 2020
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8.2-A 64 bits
Process Node
5nm FinFET (TSMC N5)

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1 x Cortex-A77 + 3 x Cortex-A77 + 4 x Cortex-A55
Clock Frequency
1 x 3.13 GHz + 3 x 2.54 GHz + 4 x 2.05 GHz
CPU Performance Score
78

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (A77), 32 KB per core (A55)
L2 Cache
512 KB per A77 core, 128 KB per A55 core
L3 Cache
3 MB
Cache Performance Score
76

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
12 GB
ECC Memory Support
No
Memory Performance Score
80

GPU Specifications

GPU Name
Mali-G78 MP24
GPU Clock Speed
760 MHz
GPU Core Count
24
FP32 Performance
~2.6 TFLOPS
GPU Performance Score
82

Display & Camera

Max Screen Resolution
4K (3840 x 2160)
Camera Support
Single 200 MP or Dual 48 MP + 48 MP or Triple camera
Max Camera Resolution
200 MP
Image Signal Processor
Dual ISP
ISP Details
Dual 16-bit ISP with support for up to 200MP single camera or dual 48MP cameras, 4K @ 60fps video recording, 8K video playback support, HDR10+ video recording, Multi-frame noise reduction with AI, Zero Shutter Lag, Dual-phase detection autofocus with laser AF, Real-time bokeh effects with depth mapping, AI scene detection with 1500+ scenarios, Night mode with extended exposure, Super resolution zoom, Multi-camera video recording, RAW domain processing

AI & Neural Processing

AI Performance Score
N/A
NPU Type
Dual-core NPU (Da Vinci Architecture 2.0)
AI Performance (TOPS)
~15.6 TOPS

Connectivity

Integrated Modem
Integrated 5G Modem (Balong 5000)
WLAN Support
5G NR SA/NSA, 4G LTE Cat 21, HSPA+, GSM/EDGE
Modem Speed
5G: 4.6 Gbps (DL), 2.5 Gbps (UL), 4G LTE: 2.0 Gbps (DL), 200 Mbps (UL)
Bluetooth Version
5.2
WiFi Standard
Wi-Fi 6+ (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 120fps, 8K @ 30fps (H.264, H.265/HEVC, VP9, AVS3)
Video Encode Support
4K @ 60fps (H.264, H.265)
Max Video Resolution
8K @ 30fps decode, 4K @ 60fps encode

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
9W
Power Efficiency Score
76
Overall Efficiency Score
78

Benchmark Results

Geekbench 6 Single
~1050
Geekbench 6 Multi
~3500
AnTuTu 10
~820000
GFXBench Aztec
N/A

Security & Additional Features

Security Features
TrustZone, Secure Boot, Hardware-backed Keystore, inSE (integrated Secure Element), Secure Payment, 3D Face Unlock with liveness detection, In-display fingerprint support
Additional Features
Huawei's flagship 5nm chipset and last TSMC-manufactured Kirin, World's first 5nm 5G SoC, Industry-leading Mali-G78 MP24 GPU configuration with 24 cores, 1+3+4 Cortex-A77/A55 CPU cluster with prime core at 3.13 GHz, Integrated Balong 5000 5G modem with SA and NSA support, Quad-channel LPDDR5 memory for exceptional bandwidth, Dual-core NPU with Da Vinci Architecture 2.0, 15.6 TOPS AI performance for flagship AI capabilities, Support for 200MP camera sensors, Dual 16-bit ISP with advanced imaging, 8K video playback support, 4K @ 60fps HDR10+ video recording, Wi-Fi 6+ with 160 MHz bandwidth support, UFS 3.1 storage for fast data transfer, Used exclusively in Huawei Mate 40 series and P50 series, Highly competitive with Snapdragon 888 and Exynos 2100, Excellent gaming performance with sustained framerates, Advanced thermal management system, Support for high refresh rate displays up to 120Hz, Enhanced AI photography capabilities, Last flagship Kirin before US sanctions, Considered one of the best Kirin chips ever made, Strong GPU performance rivaling Snapdragon flagship, Excellent power efficiency for 5nm generation, AVS3 video codec support for Chinese market, NavIC positioning support, Dual NPU for enhanced AI processing, Supports simultaneous dual 5G connections
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