General Information
Launch Date
Q3 2018
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
12nm FinFET (TSMC 12nm FFC)
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
4 x Cortex-A73 (big) + 4 x Cortex-A53 (little)
Clock Frequency
4 x 2.2 GHz + 4 x 1.7 GHz
CPU Performance Score
54
Cache Memory
L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (A73), 32 KB per core (A53)
L2 Cache
2 MB shared
L3 Cache
N/A
Cache Performance Score
50
Memory Specifications
Memory Type
LPDDR4X
Memory Bus Width
64-bit
Memory Channels
2
Maximum Memory Size
6 GB
ECC Memory Support
No
Memory Performance Score
52
GPU Specifications
GPU Name
Mali-G51 MP4
GPU Clock Speed
650 MHz
GPU Core Count
4
FP32 Performance
~0.13 TFLOPS
GPU Performance Score
48
Display & Camera
Max Screen Resolution
FHD+ (2340 x 1080)
Camera Support
Single 40 MP or Dual 20 MP + 20 MP
Max Camera Resolution
40 MP
Image Signal Processor
Dual ISP 14-bit
ISP Details
Dual ISP with 14-bit processing, Support for 40MP single camera or dual 20MP cameras, Real-time bokeh effects, Multi-frame noise reduction, Hardware-based face detection, AI-enhanced photography, Phase detection autofocus, HDR video recording, Zero shutter lag
AI & Neural Processing
AI Performance Score
N/A
NPU Type
Kirin NPU (Dedicated Neural Processing Unit)
AI Performance (TOPS)
~0.5 TOPS
Connectivity
Integrated Modem
LTE Cat 12/13
WLAN Support
4G LTE Cat 12/13, HSPA+, GSM/EDGE
Modem Speed
4G LTE: 600 Mbps (DL), 150 Mbps (UL)
Bluetooth Version
4.2
WiFi Standard
Wi-Fi 5 (802.11ac)
Video & Media Capabilities
Video Decode Support
4K @ 30fps (H.264, H.265/HEVC)
Video Encode Support
4K @ 30fps (H.264, H.265)
Max Video Resolution
4K @ 30fps
Storage & Power Efficiency
Storage Type
UFS 2.1, eMMC 5.1
Thermal Design Power
5W
Power Efficiency Score
62
Overall Efficiency Score
58
Benchmark Results
Geekbench 6 Single
N/A
Geekbench 6 Multi
N/A
AnTuTu 10
N/A
GFXBench Aztec
N/A
Security & Additional Features
Security Features
ARM TrustZone, Secure Boot, inSE (integrated Secure Element), Hardware-backed Keystore, Face unlock support, Fingerprint authentication
Additional Features
HiSilicon's first mid-range chipset with dedicated NPU for AI, 12nm process for improved power efficiency over 16nm predecessors, First Kirin 700 series chipset marking entry into mid-range segment, Cortex-A73 cores provide strong single-thread performance, Mali-G51 MP4 GPU with support for modern graphics APIs, GPU Turbo technology support for enhanced gaming performance, LPDDR4X memory support for better power efficiency, Dual ISP with AI enhancements for camera processing, LTE Cat 12/13 modem for fast mobile connectivity, Support for dual 4G VoLTE, Wi-Fi 802.11ac with 2x2 MIMO, Bluetooth 4.2 with aptX HD audio codec support, Used in popular Huawei/Honor mid-range devices, Featured in Honor 10 Lite, Huawei P Smart 2019, Honor 8X, Honor Play 8A, Good balance of performance and power efficiency, Strong AI photography capabilities for the segment, Competitive alternative to Snapdragon 660/670 in mid-range market, Popular in budget-conscious markets, Reliable thermal management, Good sustained performance for daily tasks, Support for GPU Turbo 2.0 gaming optimization, Capable of handling most mobile games at medium settings, Excellent battery life optimization, Strong software support from EMUI