General Information
Launch Date
Q4 2024
Fabrication Process
TSMC
Die Size
90 mm²
Socket Type
Mobile SoC
Instruction Set
ARMv9.2-A 64 bits
Process Node
3nm FinFET (TSMC N3E)
CPU Specifications
Core Count
6
Thread Count
6
Microarchitecture
2 x Everest (performance) + 4 x Sawtooth (efficiency)
Clock Frequency
2 x 4.04 GHz + 4 x 2.42 GHz
CPU Performance Score
85
Cache Memory
L1 Instruction Cache
192 KB per P-core, 128 KB per E-core
L1 Data Cache
128 KB per P-core, 64 KB per E-core
L2 Cache
8 MB (P-cluster), 4 MB (E-cluster)
L3 Cache
12 MB System Level Cache (SLC)
Cache Performance Score
82
Memory Specifications
Memory Type
LPDDR5X
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
8 GB
ECC Memory Support
No
Memory Performance Score
84
GPU Specifications
GPU Name
Apple A18 GPU (5-core)
GPU Clock Speed
~1400 MHz
GPU Core Count
5
FP32 Performance
~1.75 TFLOPS
GPU Performance Score
86
Display & Camera
Max Screen Resolution
4K (3840 x 2160)
Camera Support
Single 48 MP or Dual camera
Max Camera Resolution
48 MP
Image Signal Processor
Apple Image Signal Processor
ISP Details
Advanced ISP with Photonic Engine, Deep Fusion, Smart HDR 5, Next-generation portraits with Focus and Depth Control, Spatial photo and video capture, 4K60 Dolby Vision HDR recording, Cinematic mode up to 4K30, Action mode video stabilization, Zero Shutter Lag
AI & Neural Processing
AI Performance Score
92
NPU Type
16-core Neural Engine
AI Performance (TOPS)
35 TOPS
Connectivity
Integrated Modem
Qualcomm Snapdragon X70 / X71 (5G)
WLAN Support
5G NR (Sub-6 GHz, mmWave), 4G LTE Gigabit-class, VoLTE, Wi-Fi calling
Modem Speed
5G: Multi-gigabit speeds, 4G LTE Advanced with 4x4 MIMO and LAA
Bluetooth Version
5.3
WiFi Standard
Wi-Fi 6E (802.11ax)
Video & Media Capabilities
Video Decode Support
4K @ 120fps (H.264, HEVC, VP9, AV1)
Video Encode Support
4K @ 60fps (H.264, HEVC)
Max Video Resolution
4K @ 60fps Dolby Vision HDR
Storage & Power Efficiency
Storage Type
NVMe (Gen 4.0)
Thermal Design Power
9W (peak), 3-4W (sustained)
Power Efficiency Score
88
Overall Efficiency Score
86
Benchmark Results
Geekbench 6 Single
~3400
Geekbench 6 Multi
~8400
AnTuTu 10
~1,650,000
GFXBench Aztec
N/A
Security & Additional Features
Security Features
Secure Enclave, Secure Boot, Hardware-backed Keystore, Face ID support, Apple Pay, Data Protection, Secure Element, Memory tagging (MTE), Pointer Authentication Codes (PAC)
Additional Features
First A-series chip for standard iPhone models built on 3nm process, 30% faster CPU than A16 Bionic, 40% faster GPU than A16 Bionic, Hardware-accelerated ray tracing debuts on non-Pro iPhone, Mesh shading support, Dynamic caching for GPU efficiency, Apple Intelligence capable with 8GB RAM (first for standard iPhone), 17% more memory bandwidth than A16, 35% less power consumption for equivalent performance, Powers iPhone 16 and iPhone 16 Plus, ARMv9.2-A architecture, MetalFX upscaling support, USB 2.0 speeds only (480 Mbps), No ProMotion or Always-On Display support, Gaming performance leap with sustained framerates, Enhanced machine learning capabilities, Camera Capture button support, Spatial video recording, Advanced computational photography, Unified memory architecture, TSMC N3E process node, Codename: Donan, 2x faster machine learning vs A16, Desktop-class GPU architecture, Hardware video encoding improvements, Wi-Fi 6E support, Bluetooth 5.3, Second-gen Ultra Wideband chip, Support for latest iOS features, Advanced display engine, Photonic Engine for improved low-light photography