General Information
Launch Date
Q4 2015
Fabrication Process
TSMC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8-A 64 bits
Process Node
28nm HPC+
CPU Specifications
Core Count
8
Thread Count
8
Microarchitecture
8 x Cortex-A53
Clock Frequency
4 x 2.0 GHz + 4 x 1.2 GHz
CPU Performance Score
45
Cache Memory
L1 Instruction Cache
32 KB per core
L1 Data Cache
32 KB per core
L2 Cache
512 KB per cluster
L3 Cache
N/A
Cache Performance Score
40
Memory Specifications
Memory Type
LPDDR3
Memory Bus Width
32-bit
Memory Channels
1
Maximum Memory Size
4 GB
ECC Memory Support
No
Memory Performance Score
38
GPU Specifications
GPU Name
ARM Mali-T860 MP2
GPU Clock Speed
700 MHz
GPU Core Count
2 cores
FP32 Performance
~0.089 TFLOPS
GPU Performance Score
42
Display & Camera
Max Screen Resolution
Full HD (1920 x 1080) @ 60Hz
Camera Support
Single camera, up to 21 MP
Max Camera Resolution
21 MP @ 24fps / 16 MP @ 30fps
Image Signal Processor
TrueBridge Dual ISP
ISP Details
Dual ISP with Zero Shutter Delay (ZSD)
AI & Neural Processing
AI Performance Score
N/A
NPU Type
N/A
AI Performance (TOPS)
N/A
Connectivity
Integrated Modem
Integrated LTE Cat. 6 Modem
WLAN Support
LTE Cat. 6, HSPA+, GSM
Modem Speed
LTE Cat. 6: 300 Mbps (DL), 50 Mbps (UL)
Bluetooth Version
4.1
WiFi Standard
Wi-Fi 5 (802.11 a/b/g/n/ac)
Video & Media Capabilities
Video Decode Support
Full HD @ 30fps (H.264, H.265)
Video Encode Support
Full HD @ 30fps (H.264)
Max Video Resolution
Full HD @ 30fps decode / Full HD @ 30fps encode
Storage & Power Efficiency
Storage Type
eMMC 5.1
Thermal Design Power
3.5W
Power Efficiency Score
55
Overall Efficiency Score
48
Benchmark Results
Geekbench 6 Single
N/A
Geekbench 6 Multi
N/A
AnTuTu 10
N/A
GFXBench Aztec
N/A
Security & Additional Features
Security Features
ARM TrustZone, Secure Boot
Additional Features
MT6300 Envelope Tracking Module (ETM) for 20% power savings at max output, True Octa-Core design (all 8 cores can run simultaneously), 30% more power efficient than other 28nm processes, CCI-400 interconnect between clusters, First processor to use TSMC 28nm HPC+ process